74HC73D,653 vs HD74HC73RP-EL feature comparison

74HC73D,653 NXP Semiconductors

Buy Now Datasheet

HD74HC73RP-EL Renesas Electronics Corporation

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS RENESAS ELECTRONICS CORP
Part Package Code SOIC SOIC
Package Description 3.90 MM, PLASTIC, MS-012, SOT-108-1, SO-14 SOP,
Pin Count 14 14
Manufacturer Package Code SOT108-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Additional Feature MASTER SLAVE OPERATION
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4
Length 8.65 mm 8.65 mm
Load Capacitance (CL) 50 pF
Logic IC Type J-K FLIP-FLOP J-K FLIP-FLOP
Max Frequency@Nom-Sup 20000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 1 1
Number of Bits 2
Number of Functions 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Output Polarity COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 240 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Trigger Type NEGATIVE EDGE
Width 3.9 mm 3.95 mm
fmax-Min 24 MHz
Base Number Matches 2 2

Compare 74HC73D,653 with alternatives

Compare HD74HC73RP-EL with alternatives