74HC688D,653 vs MM74HC688WMX feature comparison

74HC688D,653 NXP Semiconductors

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MM74HC688WMX Rochester Electronics LLC

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code SOP SOIC
Package Description PLASTIC, SO-20 0.300 INCH, MS-013, SOIC-20
Pin Count 20 20
Manufacturer Package Code SOT163-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature CASCADABLE CASCADABLE
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e4 e3
Length 12.8 mm 12.8015 mm
Load Capacitance (CL) 50 pF
Logic IC Type IDENTITY COMPARATOR MAGNITUDE COMPARATOR
Moisture Sensitivity Level 1 1
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP20,.4 SOP20,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 51 ns 220 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.65 mm 2.642 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 7.5 mm 7.5 mm
Base Number Matches 2 2
Pbfree Code Yes

Compare 74HC688D,653 with alternatives

Compare MM74HC688WMX with alternatives