74HC597PW-T
vs
MC74HC597N
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Package Description
TSSOP,
DIP, DIP16,.3
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Count Direction
RIGHT
RIGHT
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G16
R-PDIP-T16
JESD-609 Code
e4
e0
Length
5 mm
19.175 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
PARALLEL IN SERIAL OUT
PARALLEL IN SERIAL OUT
Moisture Sensitivity Level
1
Number of Bits
8
8
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
IN-LINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
265 ns
256 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
4.44 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
4.5 V
4.5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
4.4 mm
7.62 mm
fmax-Min
20 MHz
20 MHz
Base Number Matches
1
2
Part Package Code
DIP
Pin Count
16
Max Frequency@Nom-Sup
20000000 Hz
Package Equivalence Code
DIP16,.3
Compare 74HC597PW-T with alternatives
Compare MC74HC597N with alternatives