74HC597PW vs 74HC597PW-Q100J feature comparison

74HC597PW Nexperia

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74HC597PW-Q100J NXP Semiconductors

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Rohs Code Yes
Part Life Cycle Code Active Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Date Of Intro 1995-11-01
Count Direction RIGHT RIGHT
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4
Length 5 mm 5 mm
Load Capacitance (CL) 50 pF
Logic IC Type PARALLEL IN SERIAL OUT PARALLEL IN SERIAL OUT
Moisture Sensitivity Level 1
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 265 ns 265 ns
Qualification Status Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 4.4 mm 4.4 mm
fmax-Min 20 MHz 24 MHz
Base Number Matches 2 2
Part Package Code TSSOP
Package Description 4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16
Pin Count 16
Manufacturer Package Code SOT403-1
Screening Level AEC-Q100

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