74HC590D vs 5962-8751701EA feature comparison

74HC590D NXP Semiconductors

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5962-8751701EA Defense Logistics Agency

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS DEFENSE LOGISTICS AGENCY
Part Package Code SOIC
Package Description SOP, SOP16,.25 CERAMIC, DIP-16
Pin Count 16
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
Additional Feature TCO OUTPUT;REGISTERED OUTPUTS
Count Direction UP UP
Family HC/UH LS
JESD-30 Code R-PDSO-G16 R-GDIP-T16
JESD-609 Code e4 e0
Length 9.9 mm 19.56 mm
Load Capacitance (CL) 50 pF
Load/Preset Input NO YES
Logic IC Type BINARY COUNTER BINARY COUNTER
Max I(ol) 0.006 A
Mode of Operation ASYNCHRONOUS ASYNCHRONOUS
Moisture Sensitivity Level 1
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 260 NOT APPLICABLE
Propagation Delay (tpd) 230 ns 33 ns
Qualification Status Not Qualified Qualified
Seated Height-Max 1.75 mm 5.08 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS TTL
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT APPLICABLE
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 3.9 mm 7.62 mm
fmax-Min 26 MHz 20 MHz
Base Number Matches 3 1
Screening Level MIL-STD-883

Compare 74HC590D with alternatives

Compare 5962-8751701EA with alternatives