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74HC4514PW,112 vs TC74HC138AF-TP1 feature comparison

74HC4514PW,112 NXP Semiconductors

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TC74HC138AF-TP1 Toshiba America Electronic Components

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Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code TSSOP2 SOIC
Package Description SOT-355, 24 PIN SOP,
Pin Count 24 16
Manufacturer Package Code SOT355-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ADDRESS LATCHES 3 ENABLE INPUTS
Family HC/UH HC/UH
Input Conditioning LATCHED STANDARD
JESD-30 Code R-PDSO-G24 R-PDSO-G16
JESD-609 Code e4 e0
Length 7.8 mm 10.3 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type OTHER DECODER/DRIVER 3-LINE TO 8-LINE DECODER
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 24 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP SOP
Package Equivalence Code TSSOP24,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Prop. Delay@Nom-Sup 69 ns
Propagation Delay (tpd) 69 ns 190 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.9 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 4.4 mm 5.3 mm
Base Number Matches 2 1
Pbfree Code No
ECCN Code EAR99
Logic » Decoder/Drivers
Logic » Decoder/Drivers

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