74HC4514N
vs
74HCT154DB
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
DIP, DIP24,.6
|
SSOP, SSOP24,.3
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-PDIP-T24
|
R-PDSO-G24
|
| JESD-609 Code |
e3
|
e4
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
OTHER DECODER/DRIVER
|
OTHER DECODER/DRIVER
|
| Max I(ol) |
0.004 A
|
0.004 A
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
24
|
24
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
SSOP
|
| Package Equivalence Code |
DIP24,.6
|
SSOP24,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, SHRINK PITCH
|
| Prop. Delay@Nom-Sup |
69 ns
|
53 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
| Terminal Finish |
Matte Tin (Sn)
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
3
|
3
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
TSSOP
|
| Pin Count |
|
24
|
| Additional Feature |
|
2 ENABLE INPUTS
|
| Family |
|
HCT
|
| Input Conditioning |
|
STANDARD
|
| Length |
|
8.2 mm
|
| Moisture Sensitivity Level |
|
1
|
| Output Polarity |
|
INVERTED
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Propagation Delay (tpd) |
|
53 ns
|
| Seated Height-Max |
|
2 mm
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
| Width |
|
5.3 mm
|
|
|
|
Compare 74HCT154DB with alternatives