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74HC4514N vs 74HC4515D,653 feature comparison

74HC4514N NXP Semiconductors

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74HC4515D,653 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code DIP SOP
Package Description DIP, DIP24,.6 SO-24
Pin Count 24 24
Reach Compliance Code unknown compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ADDRESS LATCHES ADDRESS LATCHES
Family HC/UH HC/UH
Input Conditioning LATCHED LATCHED
JESD-30 Code R-PDIP-T24 R-PDSO-G24
JESD-609 Code e3 e4
Length 31.7 mm 15.4 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type OTHER DECODER/DRIVER OTHER DECODER/DRIVER
Max I(ol) 0.004 A 0.004 A
Number of Functions 1 1
Number of Terminals 24 24
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP24,.6 SOP24,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Prop. Delay@Nom-Sup 69 ns 75 ns
Propagation Delay (tpd) 69 ns 75 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.1 mm 2.65 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish TIN Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 15.24 mm 7.5 mm
Base Number Matches 4 1
Manufacturer Package Code SOT137-1
Moisture Sensitivity Level 1
Packing Method TR
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
Logic » Decoder/Drivers
Logic » Decoder/Drivers

Compare 74HC4514N with alternatives

Compare 74HC4515D,653 with alternatives