74HC4514DB vs 74HC4514PW,112 feature comparison

74HC4514DB Nexperia

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74HC4514PW,112 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NEXPERIA NXP SEMICONDUCTORS
Package Description SSOP-24 SOT-355, 24 PIN
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 2017-02-01
Family HC/UH HC/UH
Input Conditioning LATCHED LATCHED
JESD-30 Code R-PDSO-G24 R-PDSO-G24
JESD-609 Code e4 e4
Length 8.2 mm 7.8 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type 4-LINE TO 16-LINE DECODER OTHER DECODER/DRIVER
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 24 24
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP TSSOP
Package Equivalence Code SSOP24,.3 TSSOP24,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Power Supply Current-Max (ICC) 0.16 mA
Propagation Delay (tpd) 345 ns 69 ns
Seated Height-Max 2 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 5.3 mm 4.4 mm
Base Number Matches 2 2
Part Package Code TSSOP2
Pin Count 24
Manufacturer Package Code SOT355-1
Additional Feature ADDRESS LATCHES
Max I(ol) 0.004 A
Prop. Delay@Nom-Sup 69 ns
Qualification Status Not Qualified

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