74HC4066DB vs CD4052BFMS feature comparison

74HC4066DB NXP Semiconductors

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CD4052BFMS Intersil Corporation

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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS INTERSIL CORP
Part Package Code SSOP DIP
Package Description SSOP, SSOP14,.3 DIP,
Pin Count 14 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPST DIFFERENTIAL MULTIPLEXER
JESD-30 Code R-PDSO-G14 R-GDIP-T16
JESD-609 Code e4 e0
Length 6.2 mm
Moisture Sensitivity Level 1
Normal Position NO
Number of Channels 1 4
Number of Functions 4 1
Number of Terminals 14 16
Off-state Isolation-Nom 50 dB
On-state Resistance Match-Nom 5 Ω
On-state Resistance-Max (Ron) 142 Ω 1050 Ω
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output SEPARATE OUTPUT
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SSOP DIP
Package Equivalence Code SSOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 5.08 mm
Supply Voltage-Max (Vsup) 10 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES NO
Switch-off Time-Max 45 ns 210 ns
Switch-on Time-Max 30 ns 320 ns
Switching MAKE-BEFORE-BREAK
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 5.3 mm 7.62 mm
Base Number Matches 4 3
Neg Supply Voltage-Nom (Vsup)
Screening Level MIL-PRF-38535 Class V

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