74HC4066D-Q100
vs
TC74HC4066AFN-TP2ELP
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
NEXPERIA
|
TOSHIBA CORP
|
| Package Description |
,
|
SOP,
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
2017-02-01
|
|
| JESD-609 Code |
e4
|
|
| Moisture Sensitivity Level |
1
|
|
| Peak Reflow Temperature (Cel) |
260
|
240
|
| Screening Level |
AEC-Q100
|
|
| Terminal Finish |
NICKEL PALLADIUM GOLD SILVER
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Base Number Matches |
2
|
1
|
| Pbfree Code |
|
No
|
| Part Package Code |
|
SOIC
|
| Pin Count |
|
14
|
| Analog IC - Other Type |
|
SPST
|
| JESD-30 Code |
|
R-PDSO-G14
|
| Length |
|
8.65 mm
|
| Neg Supply Voltage-Nom (Vsup) |
|
|
| Number of Channels |
|
1
|
| Number of Functions |
|
4
|
| Number of Terminals |
|
14
|
| Off-state Isolation-Nom |
|
60 dB
|
| On-state Resistance Match-Nom |
|
5 Ω
|
| On-state Resistance-Max (Ron) |
|
80 Ω
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
SOP
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.75 mm
|
| Supply Current-Max (Isup) |
|
0.08 mA
|
| Supply Voltage-Nom (Vsup) |
|
12 V
|
| Surface Mount |
|
YES
|
| Switch-off Time-Max |
|
24 ns
|
| Switch-on Time-Max |
|
12 ns
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
1.27 mm
|
| Terminal Position |
|
DUAL
|
| Width |
|
3.9 mm
|
|
|
|
Compare 74HC4066D-Q100 with alternatives
Compare TC74HC4066AFN-TP2ELP with alternatives