74HC4066D,653 vs CD4052BFMS feature comparison

74HC4066D,653 NXP Semiconductors

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CD4052BFMS Intersil Corporation

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Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS INTERSIL CORP
Part Package Code SOIC DIP
Package Description 3.90 MM, PLASTIC, SOT-108-1, MS-012, SO-14 DIP,
Pin Count 14 16
Manufacturer Package Code SOT108-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Analog IC - Other Type SPST DIFFERENTIAL MULTIPLEXER
JESD-30 Code R-PDSO-G14 R-GDIP-T16
JESD-609 Code e4 e0
Length 8.65 mm
Moisture Sensitivity Level 1
Normal Position NO
Number of Channels 1 4
Number of Functions 4 1
Number of Terminals 14 16
Off-state Isolation-Nom 50 dB
On-state Resistance Match-Nom 5 Ω
On-state Resistance-Max (Ron) 142 Ω 1050 Ω
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output SEPARATE OUTPUT
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 5.08 mm
Supply Voltage-Max (Vsup) 10 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES NO
Switch-off Time-Max 45 ns 210 ns
Switch-on Time-Max 30 ns 320 ns
Switching MAKE-BEFORE-BREAK
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm 7.62 mm
Base Number Matches 1 3
Neg Supply Voltage-Nom (Vsup)
Screening Level MIL-PRF-38535 Class V

Compare 74HC4066D,653 with alternatives

Compare CD4052BFMS with alternatives