74HC4053BQ
vs
CD4053BE
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ROCHESTER ELECTRONICS INC
|
Part Package Code |
QFN
|
DIP
|
Package Description |
2.5 X 3.5 MM, 0.85 MM, PLASTIC, MO-241, SOT763-1, QFN-16
|
DIP,
|
Pin Count |
16
|
16
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Analog IC - Other Type |
SPDT
|
SINGLE-ENDED MULTIPLEXER
|
JESD-30 Code |
R-PQCC-N16
|
R-PDIP-T16
|
JESD-609 Code |
e4
|
e4
|
Length |
3.5 mm
|
|
Moisture Sensitivity Level |
1
|
NOT APPLICABLE
|
Number of Channels |
1
|
1
|
Number of Functions |
3
|
3
|
Number of Terminals |
16
|
16
|
Off-state Isolation-Nom |
50 dB
|
|
On-state Resistance Match-Nom |
8 Ω
|
|
On-state Resistance-Max (Ron) |
160 Ω
|
240 Ω
|
Operating Temperature-Max |
125 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
DIP
|
Package Equivalence Code |
LCC16,.1X.14,20
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1 mm
|
|
Signal Current-Max |
0.025 A
|
|
Supply Current-Max (Isup) |
0.16 mA
|
|
Supply Voltage-Max (Vsup) |
10 V
|
|
Supply Voltage-Min (Vsup) |
2 V
|
|
Supply Voltage-Nom (Vsup) |
5 V
|
15 V
|
Surface Mount |
YES
|
NO
|
Switch-off Time-Max |
36 ns
|
|
Switch-on Time-Max |
37 ns
|
|
Switching |
BREAK-BEFORE-MAKE
|
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
NO LEAD
|
THROUGH-HOLE
|
Terminal Pitch |
0.5 mm
|
|
Terminal Position |
QUAD
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Width |
2.5 mm
|
|
Base Number Matches |
4
|
1
|
Pbfree Code |
|
Yes
|
|
|
|
Compare 74HC4053BQ with alternatives
Compare CD4053BE with alternatives