74HC4053BQ,115
vs
CD74HCT4052E
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ROCHESTER ELECTRONICS LLC
|
| Part Package Code |
QFN
|
|
| Package Description |
2.5 X 3.5 MM, 0.85 MM, PLASTIC, MO-241, SOT763-1, QFN-16
|
|
| Pin Count |
16
|
|
| Manufacturer Package Code |
SOT763-1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| Analog IC - Other Type |
SPDT
|
|
| JESD-30 Code |
R-PQCC-N16
|
|
| JESD-609 Code |
e4
|
|
| Length |
3.5 mm
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Channels |
1
|
|
| Number of Functions |
3
|
|
| Number of Terminals |
16
|
|
| Off-state Isolation-Nom |
50 dB
|
|
| On-state Resistance Match-Nom |
8 Ω
|
|
| On-state Resistance-Max (Ron) |
160 Ω
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
HVQCCN
|
|
| Package Equivalence Code |
LCC16,.1X.14,20
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1 mm
|
|
| Signal Current-Max |
0.025 A
|
|
| Supply Current-Max (Isup) |
0.32 mA
|
|
| Supply Voltage-Max (Vsup) |
10 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
|
| Surface Mount |
YES
|
|
| Switch-off Time-Max |
36 ns
|
|
| Switch-on Time-Max |
37 ns
|
|
| Switching |
BREAK-BEFORE-MAKE
|
|
| Technology |
CMOS
|
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
| Terminal Form |
NO LEAD
|
|
| Terminal Pitch |
0.5 mm
|
|
| Terminal Position |
QUAD
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
2.5 mm
|
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare 74HC4053BQ,115 with alternatives
Compare CD74HCT4052E with alternatives