74HC4053BQ,115 vs CD4052BFMS feature comparison

74HC4053BQ,115 NXP Semiconductors

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CD4052BFMS Intersil Corporation

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Rohs Code Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS INTERSIL CORP
Part Package Code QFN DIP
Package Description 2.5 X 3.5 MM, 0.85 MM, PLASTIC, MO-241, SOT763-1, QFN-16 DIP,
Pin Count 16 16
Manufacturer Package Code SOT763-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer NXP
Analog IC - Other Type SPDT DIFFERENTIAL MULTIPLEXER
JESD-30 Code R-PQCC-N16 R-GDIP-T16
JESD-609 Code e4 e0
Length 3.5 mm
Moisture Sensitivity Level 1
Number of Channels 1 4
Number of Functions 3 1
Number of Terminals 16 16
Off-state Isolation-Nom 50 dB
On-state Resistance Match-Nom 8 Ω
On-state Resistance-Max (Ron) 160 Ω 1050 Ω
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code HVQCCN DIP
Package Equivalence Code LCC16,.1X.14,20
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE IN-LINE
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 5.08 mm
Signal Current-Max 0.025 A
Supply Current-Max (Isup) 0.32 mA
Supply Voltage-Max (Vsup) 10 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Switch-off Time-Max 36 ns 210 ns
Switch-on Time-Max 37 ns 320 ns
Switching BREAK-BEFORE-MAKE
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form NO LEAD THROUGH-HOLE
Terminal Pitch 0.5 mm 2.54 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 2.5 mm 7.62 mm
Base Number Matches 1 3
Neg Supply Voltage-Nom (Vsup)
Screening Level MIL-PRF-38535 Class V

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