74HC4052PW-Q100/CU
vs
74HC4052PW-Q100
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
NEXPERIA
|
NXP SEMICONDUCTORS
|
| Package Description |
,
|
TSSOP-16
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SINGLE-ENDED MULTIPLEXER
|
SINGLE-ENDED MULTIPLEXER
|
| JESD-609 Code |
e4
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Screening Level |
AEC-Q100
|
AEC-Q100
|
| Terminal Finish |
NICKEL PALLADIUM GOLD SILVER
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
| Base Number Matches |
1
|
2
|
| JESD-30 Code |
|
R-PDSO-G16
|
| Length |
|
5 mm
|
| Number of Channels |
|
4
|
| Number of Functions |
|
1
|
| Number of Terminals |
|
16
|
| Off-state Isolation-Nom |
|
50 dB
|
| On-state Resistance-Max (Ron) |
|
270 Ω
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Seated Height-Max |
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
|
10 V
|
| Supply Voltage-Min (Vsup) |
|
2 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Surface Mount |
|
YES
|
| Switch-off Time-Max |
|
375 ns
|
| Switch-on Time-Max |
|
490 ns
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
AUTOMOTIVE
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Width |
|
4.4 mm
|
|
|
|
Compare 74HC4052PW-Q100/CU with alternatives