74HC4052PW,118
vs
MC74HC4052DT
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
ONSEMI
|
| Part Package Code |
TSSOP
|
TSSOP
|
| Package Description |
4.40 MM, PLASTIC, MO-153, SOT-403-1, TSSOP-16
|
|
| Pin Count |
16
|
16
|
| Manufacturer Package Code |
SOT403-1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
4 Weeks
|
| Samacsys Manufacturer |
NXP
|
|
| Analog IC - Other Type |
DIFFERENTIAL MULTIPLEXER
|
SINGLE-ENDED MULTIPLEXER
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| JESD-609 Code |
e4
|
e4
|
| Length |
5 mm
|
5 mm
|
| Moisture Sensitivity Level |
1
|
|
| Neg Supply Voltage-Max (Vsup) |
-5 V
|
-6 V
|
| Neg Supply Voltage-Min (Vsup) |
-1 V
|
-1 V
|
| Neg Supply Voltage-Nom (Vsup) |
-4.5 V
|
-4.5 V
|
| Number of Channels |
4
|
4
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Off-state Isolation-Nom |
50 dB
|
50 dB
|
| On-state Resistance Match-Nom |
6 Ω
|
18 Ω
|
| On-state Resistance-Max (Ron) |
195 Ω
|
170 Ω
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP16,.25
|
TSSOP16,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
1.2 mm
|
| Signal Current-Max |
0.025 A
|
0.025 A
|
| Supply Current-Max (Isup) |
0.32 mA
|
0.16 mA
|
| Supply Voltage-Max (Vsup) |
10 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
1 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
4.5 V
|
| Surface Mount |
YES
|
YES
|
| Switch-off Time-Max |
57 ns
|
15 ns
|
| Switch-on Time-Max |
69 ns
|
15 ns
|
| Switching |
BREAK-BEFORE-MAKE
|
BREAK-BEFORE-MAKE
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
MILITARY
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
4.4 mm
|
4.4 mm
|
| Base Number Matches |
1
|
3
|
|
|
|
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