74HC4050N,652 vs TC74HC4050AFN feature comparison

74HC4050N,652 NXP Semiconductors

Buy Now Datasheet

TC74HC4050AFN Toshiba America Electronic Components

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code DIP SOIC
Package Description DIP-16 0.150 INCH, 1.27 MM PITCH, LEAD FREE, PLASTIC, SOL-16
Pin Count 16 16
Manufacturer Package Code SOT38-4
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Samacsys Manufacturer NXP
Additional Feature CMOS-TTL LEVEL TRANSLATOR NOT AVAILABLE IN JAPAN
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T16 R-PDSO-G16
JESD-609 Code e4
Length 21.6 mm 9.9 mm
Load Capacitance (CL) 50 pF 150 pF
Logic IC Type BUFFER BUFFER
Max I(ol) 0.004 A 0.006 A
Number of Functions 6 6
Number of Inputs 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP16,.3 SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Prop. Delay@Nom-Sup 26 ns 19 ns
Propagation Delay (tpd) 26 ns 145 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 4.7 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Width 7.62 mm 3.9 mm
Base Number Matches 1 9
Pbfree Code Yes
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare 74HC4050N,652 with alternatives

Compare TC74HC4050AFN with alternatives