74HC3G34DP
vs
NLU3G16BMX1TCG
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
NEXPERIA
|
ONSEMI
|
Package Description |
TSSOP,
|
1.60 X 1 MM, 0.40 MM PITCH, LEAD FREE, ULLGA-8
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Date Of Intro |
2017-02-01
|
|
Family |
HC/UH
|
3G
|
JESD-30 Code |
S-PDSO-G8
|
R-PDSO-N8
|
JESD-609 Code |
e4
|
e4
|
Length |
3 mm
|
1.6 mm
|
Logic IC Type |
BUFFER
|
BUFFER
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
3
|
3
|
Number of Inputs |
1
|
1
|
Number of Terminals |
8
|
8
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
VSON
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, VERY THIN PROFILE
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Propagation Delay (tpd) |
125 ns
|
14.5 ns
|
Seated Height-Max |
1.1 mm
|
0.4 mm
|
Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2 V
|
1.65 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
MILITARY
|
Terminal Finish |
NICKEL PALLADIUM GOLD SILVER
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
GULL WING
|
NO LEAD
|
Terminal Pitch |
0.65 mm
|
0.4 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3 mm
|
1 mm
|
Base Number Matches |
3
|
1
|
Part Package Code |
|
SOIC
|
Pin Count |
|
8
|
Factory Lead Time |
|
4 Weeks
|
Load Capacitance (CL) |
|
50 pF
|
Max I(ol) |
|
0.004 A
|
Package Equivalence Code |
|
SOLCC6,.04,16
|
Packing Method |
|
TR
|
Prop. Delay@Nom-Sup |
|
14.5 ns
|
Qualification Status |
|
Not Qualified
|
Schmitt Trigger |
|
NO
|
|
|
|
Compare 74HC3G34DP with alternatives
Compare NLU3G16BMX1TCG with alternatives