74HC3G34DP vs NLU3G16BMX1TCG feature comparison

74HC3G34DP Nexperia

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NLU3G16BMX1TCG onsemi

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer NEXPERIA ONSEMI
Package Description TSSOP, 1.60 X 1 MM, 0.40 MM PITCH, LEAD FREE, ULLGA-8
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Date Of Intro 2017-02-01
Family HC/UH 3G
JESD-30 Code S-PDSO-G8 R-PDSO-N8
JESD-609 Code e4 e4
Length 3 mm 1.6 mm
Logic IC Type BUFFER BUFFER
Moisture Sensitivity Level 1 1
Number of Functions 3 3
Number of Inputs 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP VSON
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 125 ns 14.5 ns
Seated Height-Max 1.1 mm 0.4 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 1.65 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish NICKEL PALLADIUM GOLD SILVER NICKEL PALLADIUM GOLD
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.4 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3 mm 1 mm
Base Number Matches 3 1
Part Package Code SOIC
Pin Count 8
Factory Lead Time 4 Weeks
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Package Equivalence Code SOLCC6,.04,16
Packing Method TR
Prop. Delay@Nom-Sup 14.5 ns
Qualification Status Not Qualified
Schmitt Trigger NO

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Compare NLU3G16BMX1TCG with alternatives