Findchips: Compare 74HC3G06DC,125 vs 74AHCT3G04DP

74HC3G06DC,125 vs 74AHCT3G04DP feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes
Part Life Cycle Code	Transferred	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	NEXPERIA
Part Package Code	SSOP
Package Description	2.30 MM, PLASTIC, MO-187, SOT765-1, VSSOP-8	TSSOP,
Pin Count	8
Manufacturer Package Code	SOT765-1
Reach Compliance Code	compliant	compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	AHCT/VHCT/VT
JESD-30 Code	R-PDSO-G8	S-PDSO-G8
JESD-609 Code	e4
Length	2.3 mm	3 mm
Load Capacitance (CL)	50 pF
Logic IC Type	INVERTER	INVERTER
Max I(ol)	0.004 A
Moisture Sensitivity Level	1
Number of Functions	3	3
Number of Inputs	1	1
Number of Terminals	8	8
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-40 °C
Output Characteristics	OPEN-DRAIN
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	VSSOP	TSSOP
Package Equivalence Code	TSSOP8,.12,20
Package Shape	RECTANGULAR	SQUARE
Package Style	SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method	TR
Peak Reflow Temperature (Cel)	260
Prop. Delay@Nom-Sup	25 ns
Propagation Delay (tpd)	125 ns	10 ns
Qualification Status	Not Qualified
Schmitt Trigger	NO
Seated Height-Max	1 mm	1.1 mm
Supply Voltage-Max (Vsup)	6 V	5.5 V
Supply Voltage-Min (Vsup)	2 V	4.5 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	AUTOMOTIVE
Terminal Finish	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.5 mm	0.65 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30
Width	2 mm	3 mm
Base Number Matches	2	3
	Logic » Gates	Logic » Gates