74HC3G04DP
vs
74AHC3GU04DP
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Transferred
Ihs Manufacturer
NEXPERIA
PHILIPS SEMICONDUCTORS
Package Description
TSSOP-8
TSSOP, TSSOP8,.16
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Date Of Intro
2017-02-01
Family
HC/UH
JESD-30 Code
S-PDSO-G8
R-PDSO-G8
JESD-609 Code
e4
Length
3 mm
Logic IC Type
INVERTER
INVERTER
Moisture Sensitivity Level
1
Number of Functions
3
Number of Inputs
1
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
SQUARE
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
110 ns
Seated Height-Max
1.1 mm
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
NICKEL PALLADIUM GOLD SILVER
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.635 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3 mm
Base Number Matches
3
3
Load Capacitance (CL)
50 pF
Max I(ol)
0.008 A
Package Equivalence Code
TSSOP8,.16
Packing Method
TR
Prop. Delay@Nom-Sup
9 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
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