74HC373PW,112 vs 74HC373BQ-Q100,115 feature comparison

74HC373PW,112 NXP Semiconductors

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74HC373BQ-Q100,115 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code TSSOP2 QFN
Package Description 4.40 MM, PLASTIC, MO-153, SOT-360-1, TSSOP-20 2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20
Pin Count 20 20
Manufacturer Package Code SOT360-1 SOT764-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G20 R-PQCC-N20
JESD-609 Code e4
Length 6.5 mm 4.5 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.006 A 0.006 A
Moisture Sensitivity Level 1 1
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP HVQCCN
Package Equivalence Code TSSOP20,.25 LCC20,.1X.18,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Packing Method TUBE TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 45 ns 45 ns
Propagation Delay (tpd) 265 ns 265 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING NO LEAD
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 4.4 mm 2.5 mm
Base Number Matches 2 2
Screening Level AEC-Q100

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