74HC373BQ-Q100,115
vs
MC74HC373ADT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Part Package Code
QFN
TSSOP
Package Description
2.50 X 4.50 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT764-1, DHVQFN-20
TSSOP,
Pin Count
20
20
Manufacturer Package Code
SOT764-1
Reach Compliance Code
compliant
unknown
Family
HC/UH
HC/UH
JESD-30 Code
R-PQCC-N20
R-PDSO-G20
Length
4.5 mm
6.5 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.006 A
Moisture Sensitivity Level
1
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
TSSOP
Package Equivalence Code
LCC20,.1X.18,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
45 ns
Propagation Delay (tpd)
265 ns
42 ns
Qualification Status
Not Qualified
Not Qualified
Screening Level
AEC-Q100
Seated Height-Max
1 mm
1.2 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Form
NO LEAD
GULL WING
Terminal Pitch
0.5 mm
0.65 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
2.5 mm
4.4 mm
Base Number Matches
2
4
HTS Code
8542.39.00.01
JESD-609 Code
e0
Terminal Finish
Tin/Lead (Sn/Pb)
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