74HC367D-T vs TC74HC367AFN-TP2 feature comparison

74HC367D-T Philips Semiconductors

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TC74HC367AFN-TP2 Toshiba America Electronic Components

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS TOSHIBA CORP
Package Description SOP, SOP16,.25 SOP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Control Type ENABLE LOW
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.006 A
Moisture Sensitivity Level 1
Number of Bits 6 6
Number of Functions 2 1
Number of Terminals 16 16
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Packing Method TR
Peak Reflow Temperature (Cel) 260 240
Prop. Delay@Nom-Sup 38 ns
Qualification Status Not Qualified Not Qualified
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 2 1
Pbfree Code No
Part Package Code SOIC
Pin Count 16
Additional Feature ONE FUNCTION WITH TWO BITS
Family HC/UH
Length 9.9 mm
Number of Ports 2
Propagation Delay (tpd) 24 ns
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm

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