74HC32NB
vs
JM38510/30501BDA
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
MOTOROLA INC
Package Description
DIP,
DFP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
kg CO2e/kg
12.4
Average Weight (mg)
1630.6
CO2e (mg)
20219.441
Category CO2 Kg
12.4
Compliance Temperature Grade
Automotive: -40C to +125C
Family
HC/UH
LS
JESD-30 Code
R-PDIP-T14
R-GDFP-F14
Length
19.025 mm
9.65 mm
Load Capacitance (CL)
50 pF
Logic IC Type
OR GATE
OR GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
DIP
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
FLATPACK
Propagation Delay (tpd)
27 ns
35 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
4.2 mm
2.15 mm
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
TTL
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Form
THROUGH-HOLE
FLAT
Terminal Pitch
2.54 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
6.415 mm
Base Number Matches
1
1
Part Package Code
DFP
Pin Count
14
Compare 74HC32NB with alternatives
Compare JM38510/30501BDA with alternatives