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74HC32BQ,115 vs 74AHC132BQ,115 feature comparison

74HC32BQ,115 NXP Semiconductors

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74AHC132BQ,115 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code QFN QFN
Package Description 2.50 X 3 MM, 0.85 MM HEIGHT, PLASTIC, MO-241, SOT-762-1, DHVQFN-14 HVQCCN, LCC14,.1X.12,20
Pin Count 14 14
Manufacturer Package Code SOT762-1 SOT762-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH AHC/VHC/H/U/V
JESD-30 Code R-PQCC-N14 R-PQCC-N14
JESD-609 Code e4 e4
Length 3 mm 3 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type OR GATE NAND GATE
Max I(ol) 0.004 A 0.008 A
Moisture Sensitivity Level 1 1
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVQCCN HVQCCN
Package Equivalence Code LCC14,.1X.12,20 LCC14,.1X.12,20
Package Shape RECTANGULAR RECTANGULAR
Package Style CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Packing Method TR TR
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 27 ns 12.5 ns
Propagation Delay (tpd) 135 ns 19.5 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO YES
Seated Height-Max 1 mm 1 mm
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form NO LEAD NO LEAD
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 30
Width 2.5 mm 2.5 mm
Base Number Matches 2 2
Logic » Gates
Logic » Gates

Compare 74HC32BQ,115 with alternatives

Compare 74AHC132BQ,115 with alternatives