74HC30DB,118
vs
74HC30DB,112
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NEXPERIA
Part Package Code
SSOP1
SSOP1
Pin Count
14
14
Manufacturer Package Code
SOT337-1
SOT337-1
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Samacsys Manufacturer
NXP
Nexperia
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e4
e4
Length
6.2 mm
6.2 mm
Load Capacitance (CL)
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Inputs
8
8
Number of Terminals
14
14
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
SSOP
Package Equivalence Code
SSOP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE, SHRINK PITCH
Packing Method
TR
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
39 ns
Propagation Delay (tpd)
39 ns
39 ns
Qualification Status
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
2 mm
2 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
5.3 mm
5.3 mm
Base Number Matches
1
1
Package Description
SOP-14
Date Of Intro
2017-02-01
Compare 74HC30DB,118 with alternatives
Compare 74HC30DB,112 with alternatives