Findchips: Compare 74HC30D,653 vs TC74HC30AFN-TP2

74HC30D,653 vs TC74HC30AFN-TP2 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	No
Part Life Cycle Code	Transferred	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	TOSHIBA CORP
Part Package Code	SOIC	SOIC
Pin Count	14	14
Manufacturer Package Code	SOT108-1
Reach Compliance Code	compliant	unknown
HTS Code	8542.39.00.01	8542.39.00.01
Factory Lead Time	4 Weeks
Family	HC/UH	HC/UH
JESD-30 Code	R-PDSO-G14	R-PDSO-G14
JESD-609 Code	e4
Length	8.65 mm	8.65 mm
Load Capacitance (CL)	50 pF	50 pF
Logic IC Type	NAND GATE	NAND GATE
Max I(ol)	0.004 A
Moisture Sensitivity Level	1
Number of Functions	1	1
Number of Inputs	8	8
Number of Terminals	14	14
Operating Temperature-Max	125 °C	85 °C
Operating Temperature-Min	-40 °C	-40 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	SOP	SOP
Package Equivalence Code	SOP14,.25
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE	SMALL OUTLINE
Packing Method	TR
Peak Reflow Temperature (Cel)	260	240
Prop. Delay@Nom-Sup	39 ns
Propagation Delay (tpd)	39 ns	29 ns
Qualification Status	Not Qualified	Not Qualified
Schmitt Trigger	NO
Seated Height-Max	1.75 mm	1.75 mm
Supply Voltage-Max (Vsup)	6 V	6 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	5 V	5 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	INDUSTRIAL
Terminal Finish	Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form	GULL WING	GULL WING
Terminal Pitch	1.27 mm	1.27 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30	NOT SPECIFIED
Width	3.9 mm	3.9 mm
Base Number Matches	1	3
Pbfree Code		No
Package Description		SOP,
	Logic » Gates	Logic » Gates