74HC2G02DP
vs
74HC2G02DC,125
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
NEXPERIA
Part Package Code
SOIC
SSOP
Package Description
TSSOP, TSSOP8,.16
2.30 MM, PLASTIC, MO-187, SOT-765-1, VSSOP-8
Pin Count
8
8
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
S-PDSO-G8
R-PDSO-G8
JESD-609 Code
e4
e4
Length
3 mm
2.3 mm
Load Capacitance (CL)
50 pF
Logic IC Type
NOR GATE
NOR GATE
Max I(ol)
0.004 A
Moisture Sensitivity Level
1
1
Number of Functions
2
2
Number of Inputs
2
2
Number of Terminals
8
8
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
VSSOP
Package Equivalence Code
TSSOP8,.16
TSSOP8,.12,20
Package Shape
SQUARE
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Packing Method
TR
TR, 7 INCH
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
22 ns
Propagation Delay (tpd)
110 ns
110 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Seated Height-Max
1.1 mm
1 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
NICKEL PALLADIUM GOLD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.5 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
3 mm
2 mm
Base Number Matches
3
2
Manufacturer Package Code
SOT765-1
Samacsys Manufacturer
Nexperia
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