74HC2G02DP vs 74HC2G02DC,125 feature comparison

74HC2G02DP NXP Semiconductors

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74HC2G02DC,125 Nexperia

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code SOIC SSOP
Package Description TSSOP, TSSOP8,.16 2.30 MM, PLASTIC, MO-187, SOT-765-1, VSSOP-8
Pin Count 8 8
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code S-PDSO-G8 R-PDSO-G8
JESD-609 Code e4 e4
Length 3 mm 2.3 mm
Load Capacitance (CL) 50 pF
Logic IC Type NOR GATE NOR GATE
Max I(ol) 0.004 A
Moisture Sensitivity Level 1 1
Number of Functions 2 2
Number of Inputs 2 2
Number of Terminals 8 8
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP VSSOP
Package Equivalence Code TSSOP8,.16 TSSOP8,.12,20
Package Shape SQUARE RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
Packing Method TR TR, 7 INCH
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 22 ns
Propagation Delay (tpd) 110 ns 110 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.1 mm 1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.5 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 3 mm 2 mm
Base Number Matches 3 2
Manufacturer Package Code SOT765-1
Samacsys Manufacturer Nexperia

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