74HC273U vs SN54LS273J feature comparison

74HC273U NXP Semiconductors

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SN54LS273J Rochester Electronics LLC

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Part Life Cycle Code Obsolete Contact Manufacturer
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code DIE DIP
Package Description DIE, DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH LS
JESD-30 Code R-XUUC-N R-CDIP-T20
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 8 8
Number of Functions 1 1
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity TRUE TRUE
Package Body Material UNSPECIFIED CERAMIC, METAL-SEALED COFIRED
Package Code DIE DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style UNCASED CHIP IN-LINE
Propagation Delay (tpd) 225 ns 27 ns
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 6 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology CMOS TTL
Temperature Grade AUTOMOTIVE MILITARY
Terminal Form NO LEAD THROUGH-HOLE
Terminal Position UPPER DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
fmax-Min 24 MHz 30 MHz
Base Number Matches 1 2
Pin Count 20
Length 24.515 mm
Number of Terminals 20
Seated Height-Max 5.08 mm
Terminal Pitch 2.54 mm
Width 7.62 mm

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