74HC273DB,112 vs TC74LVX273FW(ELP) feature comparison

74HC273DB,112 NXP Semiconductors

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TC74LVX273FW(ELP) Toshiba America Electronic Components

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code SSOP2 SOIC
Package Description 5.30 MM, PLASTIC, MO-150, SOT-339-1, SSOP-20 SOP, SOP20,.4
Pin Count 20 20
Manufacturer Package Code SOT339-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Family HC/UH LV/LV-A/LVX/H
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e4
Length 7.2 mm 12.8 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 20000000 Hz 50000000 Hz
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SOP
Package Equivalence Code SSOP20,.3 SOP20,.4
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Packing Method BULK TR
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Propagation Delay (tpd) 225 ns 24 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 2.7 mm
Supply Voltage-Max (Vsup) 6 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.3 mm 7.5 mm
fmax-Min 24 MHz 80 MHz
Base Number Matches 2 1
Pbfree Code No
Prop. Delay@Nom-Sup 16.5 ns

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