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74HC259DB vs 74HC259DB,118 feature comparison

74HC259DB NXP Semiconductors

Buy Now Datasheet

74HC259DB,118 NXP Semiconductors

Buy Now Datasheet
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SSOP SSOP1
Package Description SSOP, SSOP16,.3 5.30 MM, PLASTIC, MO-150, SOT-338-1, SSOP-16
Pin Count 16 16
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 1:8 DMUX FOLLOWED BY LATCH 1:8 DMUX FOLLOWED BY LATCH
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e4
Length 6.2 mm 6.2 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D LATCH D LATCH
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1 1
Number of Bits 1 1
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SSOP
Package Equivalence Code SSOP16,.3 SSOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 56 ns 56 ns
Propagation Delay (tpd) 255 ns 255 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Trigger Type LOW LEVEL LOW LEVEL
Width 5.3 mm 5.3 mm
Base Number Matches 2 2
Manufacturer Package Code SOT338-1
Packing Method TR
Logic » FF/Latches
Logic » FF/Latches

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Compare 74HC259DB,118 with alternatives