74HC258D,653
vs
74HC258DB-T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Part Package Code
SOP
SSOP
Package Description
SOP, SOP16,.25
SSOP, SSOP16,.3
Pin Count
16
16
Manufacturer Package Code
SOT109-1
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
HC/UH
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e4
e4
Length
9.9 mm
6.2 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.006 A
0.006 A
Moisture Sensitivity Level
1
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SSOP
Package Equivalence Code
SOP16,.25
SSOP16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE, SHRINK PITCH
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Prop. Delay@Nom-Sup
29 ns
29 ns
Propagation Delay (tpd)
145 ns
145 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
2 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
NOT SPECIFIED
Width
3.9 mm
5.3 mm
Base Number Matches
1
1
Compare 74HC258D,653 with alternatives
Compare 74HC258DB-T with alternatives