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74HC240DB,112 vs TC74HC240AFW-ELP feature comparison

74HC240DB,112 NXP Semiconductors

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TC74HC240AFW-ELP Toshiba America Electronic Components

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Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code SSOP2 SOIC
Package Description 5.30 MM, PLASTIC, MO-150, SOT339-1, SSOP-20 SOP,
Pin Count 20 20
Manufacturer Package Code SOT339-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Control Type ENABLE LOW
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e4
Length 7.2 mm 12.8 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.006 A
Moisture Sensitivity Level 1
Number of Bits 4 4
Number of Functions 2 2
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity INVERTED INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SOP
Package Equivalence Code SSOP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Packing Method TUBE
Peak Reflow Temperature (Cel) 260 240
Prop. Delay@Nom-Sup 30 ns
Propagation Delay (tpd) 150 ns 23 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 2.7 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 5.3 mm 7.5 mm
Base Number Matches 1 2
Pbfree Code No
Logic » Bus Driver/Transceivers
Logic » Bus Driver/Transceivers

Compare 74HC240DB,112 with alternatives

Compare TC74HC240AFW-ELP with alternatives