74HC238PW,112 vs 74HC238PW feature comparison

74HC238PW,112 NXP Semiconductors

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74HC238PW Nexperia

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS NEXPERIA
Part Package Code TSSOP
Package Description TSSOP-16
Pin Count 16
Manufacturer Package Code SOT403-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 4 Weeks
Additional Feature 3 ENABLE INPUTS
Family HC/UH HC/UH
Input Conditioning STANDARD STANDARD
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e4
Length 5 mm 5 mm
Load Capacitance (CL) 50 pF
Logic IC Type 3-LINE TO 8-LINE DECODER 3-LINE TO 8-LINE DECODER
Max I(ol) 0.004 A
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP16,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 260
Prop. Delay@Nom-Sup 45 ns
Propagation Delay (tpd) 45 ns 225 ns
Qualification Status Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 4.4 mm 4.4 mm
Base Number Matches 2 2
ECCN Code EAR99
Date Of Intro 1993-01-01

Compare 74HC238PW,112 with alternatives

Compare 74HC238PW with alternatives