74HC237DB,118
vs
74VHC138J/883
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NEXPERIA
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
SSOP1
|
|
| Package Description |
5.30 MM, PLASTIC, MO-150, SOT-338-1, SSOP-16
|
DIP,
|
| Pin Count |
16
|
|
| Manufacturer Package Code |
SOT338-1
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Date Of Intro |
2017-02-01
|
|
| Samacsys Manufacturer |
Nexperia
|
|
| Additional Feature |
ADDRESS LATCHES
|
3 ENABLE INPUTS
|
| Family |
HC/UH
|
AHC/VHC/H/U/V
|
| Input Conditioning |
LATCHED
|
STANDARD
|
| JESD-30 Code |
R-PDSO-G16
|
R-GDIP-T16
|
| JESD-609 Code |
e4
|
|
| Length |
6.2 mm
|
19.43 mm
|
| Logic IC Type |
3-LINE TO 8-LINE DECODER
|
3-LINE TO 8-LINE DECODER
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
TRUE
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
SSOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Propagation Delay (tpd) |
285 ns
|
18 ns
|
| Seated Height-Max |
2 mm
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Width |
5.3 mm
|
7.62 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| Qualification Status |
|
Not Qualified
|
|
|
|
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