74HC237D,653
vs
HD74HC237RPEL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
RENESAS ELECTRONICS CORP
Part Package Code
SOP
SOIC
Package Description
3.90 MM, PLASTIC, MS-012, SOT-109-1, SOP-16
SOP, SOP16,.25
Pin Count
16
16
Manufacturer Package Code
SOT109-1
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
Additional Feature
ADDRESS LATCHES
Family
HC/UH
HC/UH
Input Conditioning
LATCHED
LATCHED
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e4
Length
9.9 mm
9.9 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
OTHER DECODER/DRIVER
3-LINE TO 8-LINE DECODER
Max I(ol)
0.004 A
0.004 A
Moisture Sensitivity Level
1
1
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP16,.25
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Packing Method
TR
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
48 ns
46 ns
Propagation Delay (tpd)
285 ns
230 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
6 V
6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
3.9 mm
3.95 mm
Base Number Matches
1
3
Pbfree Code
ECCN Code
EAR99
Compare 74HC237D,653 with alternatives
Compare HD74HC237RPEL with alternatives