74HC1GU04GW
vs
HD74HC1GU04
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
RENESAS ELECTRONICS CORP
Package Description
TSSOP, TSSOP5/6,.08
TSSOP,
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G5
R-PDSO-G5
JESD-609 Code
e3
e6
Load Capacitance (CL)
50 pF
Logic IC Type
INVERTER
INVERTER
Max I(ol)
0.002 A
Moisture Sensitivity Level
1
Number of Terminals
5
5
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP5/6,.08
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
21 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Supply Voltage-Nom (Vsup)
5 V
4.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
MATTE TIN
TIN BISMUTH
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
0.65 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
2
Part Package Code
SOIC
Pin Count
5
Family
HC/UH
Length
2 mm
Number of Functions
1
Number of Inputs
1
Propagation Delay (tpd)
125 ns
Seated Height-Max
1.1 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Width
1.25 mm
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