74HC1GU04GW
vs
74HC1GU04GW,165
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Yes
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
TSSOP, TSSOP5/6,.08
1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDSO-G5
R-PDSO-G5
JESD-609 Code
e3
e3
Load Capacitance (CL)
50 pF
Logic IC Type
INVERTER
INVERTER
Max I(ol)
0.002 A
Moisture Sensitivity Level
1
1
Number of Terminals
5
5
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP5/6,.08
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)
260
NOT SPECIFIED
Prop. Delay@Nom-Sup
21 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
AUTOMOTIVE
Terminal Finish
MATTE TIN
Tin (Sn)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.635 mm
0.65 mm
Terminal Position
DUAL
DUAL
Base Number Matches
3
2
Part Package Code
TSSOP
Pin Count
5
Manufacturer Package Code
SOT353-1
Family
HC/UH
Length
2.05 mm
Number of Functions
1
Number of Inputs
1
Propagation Delay (tpd)
105 ns
Seated Height-Max
1.1 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Width
1.25 mm
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