Findchips: Compare 74HC1GU04GW,125 vs MC74HC1GU04DFT4

74HC1GU04GW,125 vs MC74HC1GU04DFT4 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Rohs Code	Yes	No
Part Life Cycle Code	Transferred	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	ON SEMICONDUCTOR
Part Package Code	TSSOP	SOT-353
Package Description	1.25 MM, PLASTIC, MO-203, SC-88A, SOT-353-1, TSSOP-5	TSSOP, TSSOP5/6,.08
Pin Count	5	5
Manufacturer Package Code	SOT353-1
Reach Compliance Code	compliant	not_compliant
HTS Code	8542.39.00.01	8542.39.00.01
Family	HC/UH	HC/UH
JESD-30 Code	R-PDSO-G5	R-PDSO-G5
JESD-609 Code	e3	e0
Length	2.05 mm	2 mm
Logic IC Type	INVERTER	INVERTER
Moisture Sensitivity Level	1
Number of Functions	1	1
Number of Inputs	1	1
Number of Terminals	5	5
Operating Temperature-Max	125 °C	125 °C
Operating Temperature-Min	-40 °C	-55 °C
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	TSSOP	TSSOP
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel)	260
Propagation Delay (tpd)	105 ns	155 ns
Qualification Status	Not Qualified	Not Qualified
Seated Height-Max	1.1 mm	1.1 mm
Supply Voltage-Max (Vsup)	6 V	6 V
Supply Voltage-Min (Vsup)	2 V	2 V
Supply Voltage-Nom (Vsup)	5 V	3 V
Surface Mount	YES	YES
Technology	CMOS	CMOS
Temperature Grade	AUTOMOTIVE	MILITARY
Terminal Finish	Tin (Sn)	TIN LEAD
Terminal Form	GULL WING	GULL WING
Terminal Pitch	0.65 mm	0.65 mm
Terminal Position	DUAL	DUAL
Time@Peak Reflow Temperature-Max (s)	30
Width	1.25 mm	1.25 mm
Base Number Matches	1	1
Load Capacitance (CL)		50 pF
Max I(ol)		0.002 A
Package Equivalence Code		TSSOP5/6,.08
Packing Method		TR
Prop. Delay@Nom-Sup		155 ns
Schmitt Trigger		NO
	Logic » Gates	Logic » Gates