74HC1G02GW-G
vs
HD74HC1G00-EL
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Contact Manufacturer
|
Ihs Manufacturer |
NEXPERIA
|
RENESAS ELECTRONICS CORP
|
Package Description |
TSSOP,
|
TSSOP,
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Date Of Intro |
2017-02-01
|
|
Family |
HC/UH
|
HC/UH
|
JESD-30 Code |
R-PDSO-G5
|
R-PDSO-G5
|
JESD-609 Code |
e3
|
e6
|
Length |
2.05 mm
|
2 mm
|
Logic IC Type |
NOR GATE
|
NAND GATE
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Inputs |
2
|
2
|
Number of Terminals |
5
|
5
|
Operating Temperature-Max |
125 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
Propagation Delay (tpd) |
135 ns
|
125 ns
|
Seated Height-Max |
1.1 mm
|
1.1 mm
|
Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
4.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
Terminal Finish |
TIN
|
TIN BISMUTH
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
1.25 mm
|
1.25 mm
|
Base Number Matches |
1
|
1
|
Part Package Code |
|
SOIC
|
Pin Count |
|
5
|
Qualification Status |
|
Not Qualified
|
|
|
|
Compare 74HC1G02GW-G with alternatives
Compare HD74HC1G00-EL with alternatives