74HC1G00GW,165 vs NLV74HC1G00DFT1G feature comparison

74HC1G00GW,165 NXP Semiconductors

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NLV74HC1G00DFT1G onsemi

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Rohs Code Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS ONSEMI
Part Package Code TSSOP SC-88A (SC-70-5 / SOT-353)
Package Description TSSOP, SC-88A, 5 PIN
Pin Count 5 5
Manufacturer Package Code SOT353-1 419A-02
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G5 R-PDSO-G5
JESD-609 Code e3 e3
Length 2 mm 2 mm
Logic IC Type NAND GATE NAND GATE
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Propagation Delay (tpd) 135 ns 155 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Tin (Sn) Matte Tin (Sn) - annealed
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Width 1.25 mm 1.25 mm
Base Number Matches 2 1
Pbfree Code Yes
Samacsys Manufacturer onsemi
Load Capacitance (CL) 50 pF
Max I(ol) 0.0026 A
Package Equivalence Code TSSOP5/6,.08
Packing Method TR
Power Supply Current-Max (ICC) 25 mA
Prop. Delay@Nom-Sup 90 ns
Schmitt Trigger NO
Screening Level AEC-Q100

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Compare NLV74HC1G00DFT1G with alternatives