74HC193DB,112 vs TC74HC191AF(TP1) feature comparison

74HC193DB,112 NXP Semiconductors

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TC74HC191AF(TP1) Toshiba America Electronic Components

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Rohs Code Yes No
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code SSOP1 SOIC
Package Description SSOP, SSOP16,.3 SOP,
Pin Count 16 16
Manufacturer Package Code SOT338-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Additional Feature TCO UP AND TCO DOWN OUTPUTS; SEPARATE UP/DOWN CLOCK TCO OUTPUT
Count Direction BIDIRECTIONAL
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4 e0
Length 6.2 mm 10.3 mm
Load Capacitance (CL) 50 pF 50 pF
Load/Preset Input YES YES
Logic IC Type BINARY COUNTER BINARY COUNTER
Max Frequency@Nom-Sup 13000000 Hz
Max I(ol) 0.004 A
Mode of Operation SYNCHRONOUS SYNCHRONOUS
Moisture Sensitivity Level 1
Number of Bits 4 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SOP
Package Equivalence Code SSOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Packing Method BULK
Peak Reflow Temperature (Cel) 260 240
Propagation Delay (tpd) 65 ns 45 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 1.9 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 NOT SPECIFIED
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.3 mm 5.3 mm
fmax-Min 13 MHz 20 MHz
Base Number Matches 1 3
Pbfree Code No

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