74HC174DB-T
vs
TC74AC112F(TP2)
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
End Of Life
Ihs Manufacturer
NXP SEMICONDUCTORS
TOSHIBA CORP
Part Package Code
SOIC
SOIC
Package Description
SSOP,
SOP,
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
AC
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e4
e0
Length
6.2 mm
10.3 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
D FLIP-FLOP
J-K FLIP-FLOP
Moisture Sensitivity Level
1
Number of Bits
6
2
Number of Functions
1
2
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
TRUE
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
50 ns
10.8 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
1.9 mm
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
TIN LEAD
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Trigger Type
POSITIVE EDGE
NEGATIVE EDGE
Width
5.3 mm
5.3 mm
fmax-Min
20 MHz
80 MHz
Base Number Matches
1
1
Max I(ol)
0.024 A
Power Supply Current-Max (ICC)
0.08 mA
Compare 74HC174DB-T with alternatives
Compare TC74AC112F(TP2) with alternatives