74HC174DB vs HD74HC375FP feature comparison

74HC174DB NXP Semiconductors

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HD74HC375FP Hitachi Ltd

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer NXP SEMICONDUCTORS HITACHI LTD
Part Package Code SOIC SOIC
Package Description 5.3 MM, PLASTIC, SOT338-1, SSOP-16 SOP, SOP16,.3
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4
Length 6.2 mm 10.06 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D LATCH
Max Frequency@Nom-Sup 24000000 Hz
Max I(ol) 0.004 A 0.004 A
Moisture Sensitivity Level 1 1
Number of Bits 6 2
Number of Functions 1 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SOP
Package Equivalence Code SSOP16,.3 SOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 50 ns 200 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 2.2 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 4.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 20
Trigger Type POSITIVE EDGE HIGH LEVEL
Width 5.3 mm 5.5 mm
fmax-Min 20 MHz
Base Number Matches 4 2
Prop. Delay@Nom-Sup 36 ns

Compare 74HC174DB with alternatives

Compare HD74HC375FP with alternatives