74HC174DB,112 vs HD74LS375RP-EL feature comparison

74HC174DB,112 NXP Semiconductors

Buy Now Datasheet

HD74LS375RP-EL Renesas Electronics Corporation

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Transferred Contact Manufacturer
Ihs Manufacturer NXP SEMICONDUCTORS RENESAS ELECTRONICS CORP
Part Package Code SSOP1 SOIC
Package Description 5.3 MM, PLASTIC, SOT338-1, SSOP-16 SOP,
Pin Count 16 16
Manufacturer Package Code SOT338-1
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH LS
JESD-30 Code R-PDSO-G16 R-PDSO-G16
JESD-609 Code e4
Length 6.2 mm 9.9 mm
Load Capacitance (CL) 50 pF
Logic IC Type D FLIP-FLOP D LATCH
Max Frequency@Nom-Sup 20000000 Hz
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Number of Bits 6 2
Number of Functions 1 2
Number of Terminals 16 16
Operating Temperature-Max 125 °C 75 °C
Operating Temperature-Min -40 °C -20 °C
Output Polarity TRUE COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP SOP
Package Equivalence Code SSOP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE
Packing Method BULK
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 50 ns 27 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology CMOS TTL
Temperature Grade AUTOMOTIVE COMMERCIAL EXTENDED
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Trigger Type POSITIVE EDGE HIGH LEVEL
Width 5.3 mm 3.95 mm
fmax-Min 20 MHz
Base Number Matches 2 2

Compare 74HC174DB,112 with alternatives

Compare HD74LS375RP-EL with alternatives