74HC173DB,118
vs
HD74HC109FP-EL
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
RENESAS TECHNOLOGY CORP
Part Package Code
SSOP1
SOIC
Package Description
SSOP,
SOP,
Pin Count
16
16
Manufacturer Package Code
SOT338-1
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Additional Feature
WITH HOLD MODE
Family
HC/UH
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e4
Length
6.2 mm
10.06 mm
Load Capacitance (CL)
50 pF
Logic IC Type
D FLIP-FLOP
J-KBAR FLIP-FLOP
Moisture Sensitivity Level
1
Number of Bits
4
Number of Functions
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
Operating Temperature-Min
-40 °C
Output Characteristics
3-STATE
Output Polarity
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SSOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, SHRINK PITCH
SMALL OUTLINE
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Propagation Delay (tpd)
53 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2 mm
2.2 mm
Supply Voltage-Max (Vsup)
6 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
YES
YES
Technology
CMOS
Temperature Grade
AUTOMOTIVE
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Trigger Type
POSITIVE EDGE
Width
5.3 mm
5.5 mm
fmax-Min
60 MHz
Base Number Matches
2
2
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