74HC165DB
vs
MM74HC165N
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Not Recommended
|
Active
|
| Ihs Manufacturer |
NEXPERIA
|
ROCHESTER ELECTRONICS INC
|
| Package Description |
SSOP,
|
DIP,
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Date Of Intro |
1990-12-01
|
|
| Additional Feature |
CLOCK INHIBIT
|
CLOCK INHIBIT
|
| Count Direction |
RIGHT
|
RIGHT
|
| Family |
HC/UH
|
HC/UH
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDIP-T16
|
| JESD-609 Code |
e4
|
e3
|
| Length |
6.2 mm
|
19.305 mm
|
| Load Capacitance (CL) |
50 pF
|
|
| Logic IC Type |
PARALLEL IN SERIAL OUT
|
PARALLEL IN SERIAL OUT
|
| Moisture Sensitivity Level |
1
|
NOT APPLICABLE
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SSOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, SHRINK PITCH
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT APPLICABLE
|
| Propagation Delay (tpd) |
250 ns
|
189 ns
|
| Qualification Status |
Not Qualified
|
COMMERCIAL
|
| Seated Height-Max |
2 mm
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
6 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
4.5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
MATTE TIN
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
NOT APPLICABLE
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
5.3 mm
|
7.62 mm
|
| fmax-Min |
20 MHz
|
25 MHz
|
| Base Number Matches |
2
|
4
|
| Pbfree Code |
|
Yes
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
16
|
|
|
|
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