74HC164DB,112 vs MC74HC165AN feature comparison

74HC164DB,112 NXP Semiconductors

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MC74HC165AN Rochester Electronics LLC

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Rohs Code Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer NXP SEMICONDUCTORS ROCHESTER ELECTRONICS LLC
Part Package Code SSOP1 DIP
Package Description 5.30 MM, PLASTIC, MO-150, SOT337-1, SSOP-14 PLASTIC, DIP-16
Pin Count 14 16
Manufacturer Package Code SOT337-1
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01
Factory Lead Time 4 Weeks
Count Direction RIGHT RIGHT
Family HC/UH HC/UH
JESD-30 Code R-PDSO-G14 R-PDIP-T16
JESD-609 Code e4 e0
Length 6.2 mm 19.175 mm
Load Capacitance (CL) 50 pF
Logic IC Type SERIAL IN PARALLEL OUT PARALLEL IN SERIAL OUT
Max Frequency@Nom-Sup 24000000 Hz
Moisture Sensitivity Level 1 NOT SPECIFIED
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 14 16
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity TRUE COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SSOP DIP
Package Equivalence Code SSOP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) 260 240
Propagation Delay (tpd) 255 ns 225 ns
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 2 mm 4.44 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 5 V 3 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade AUTOMOTIVE MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) TIN LEAD
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.3 mm 7.62 mm
fmax-Min 24 MHz 24 MHz
Base Number Matches 2 5
Pbfree Code Yes

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