74HC157PW,112
vs
MC74VHC257DG
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
ONSEMI
Part Package Code
TSSOP
SOIC 16 LEAD
Package Description
4.40 MM, PLASTIC, MO-153, SOT403-1, TSSOP-16
SO-16
Pin Count
16
16
Manufacturer Package Code
SOT403-1
751B-05
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Factory Lead Time
4 Weeks
4 Weeks
Family
HC/UH
AHC/VHC
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
JESD-609 Code
e4
e3
Length
5 mm
9.9 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
MULTIPLEXER
MULTIPLEXER
Max I(ol)
0.004 A
0.008 A
Moisture Sensitivity Level
1
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Outputs
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Equivalence Code
TSSOP16,.25
SOP16,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Packing Method
TUBE
RAIL
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
38 ns
Propagation Delay (tpd)
38 ns
14.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.75 mm
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
AUTOMOTIVE
MILITARY
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
4.4 mm
3.9 mm
Base Number Matches
2
1
Pbfree Code
Samacsys Manufacturer
onsemi
Output Characteristics
3-STATE
Compare 74HC157PW,112 with alternatives
Compare MC74VHC257DG with alternatives